1N5059GP thru 1n5062gp vishay semiconductors formerly general semiconductor document number 88513 www.vishay.com 08-jul-02 1 glass passivated junction rectifiers reverse voltage 200 to 800v forward current 1.0a 0.034 (0.86) 0.028 (0.71) dia. 0.140 (3.6) 0.104 (2.6) dia. 0.230 (5.8) 0.300 (7.6) 1.0 (25.4) min. 1.0 (25.4) min. patented* maximum ratings & thermal characteristics ratings at 25? ambient temperature unless otherwise specified. parameter symbol 1n 1n 1n 1n unit 5059gp 5060gp 5061gp 5062gp * maximum repetitive peak reverse voltage v rrm 200 400 600 800 v maximum rms voltage v rms 140 280 420 560 v * maximum dc blocking voltage v dc 200 400 600 800 v * maximum average forward rectified current 0.375 (9.5mm) lead length at t a = 75 c i f(av) 1.0 a * peak forward surge current 8.3ms single half sine-wave i fsm 50 a superimposed on rated load (jedec method) * maximum full load reverse current, full cycle average 0.375 (9.5mm) lead length at t a = 25 ci r(av) 5.0 a t a = 75 c 150 typical thermal resistance (1) r ja 45 c/w r jl 20 operating junction and storage temperature range t j, t stg 65 to +175 c electrical characteristics ratings at 25? ambient temperature unless otherwise specified. * max. instantaneous forward voltage at 1.0a, t a = 75? v f 1.2 v * maximum dc reverse current t a = 25 c 5.0 at rated dc blocking voltage t a = 175 c i r 300 a typical reverse recovery time at t rr 2.0 s i f = 0.5a, i r = 1.0a, i rr = 0.25a typical junction capacitance at 4.0v, 1mhz c j 15 pf note: (1) thermal resistance from junction to ambient at 0.375 (9.5mm) lead length, p.c.b. mounted *jedec registered values features ?plastic package has underwriters laboratories flammability classification 94v-0 ?high temperature metallurgically bonded construction ?cavity-free glass passivated junction ?capable of meeting environmental standards of mil-s-19500 ?1.0 ampere operation at t a = 75? with no thermal runaway ?typical i r less than 0.1 a high temperature soldering guaranteed: 350?/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension mechanical data case: jedec do-204ac, molded plastic over glass body terminals: plated axial leads, solderable per mil-std-750, method 2026 polarity: color band denotes cathode end mounting position: any weight: 0.015 oz., 0.4 g do-204ac (do-15) dimensions in inches and (millimeters) * glass-plastic encapsulation technique is covered by patent no. 3,996,602 and brazed-lead assembly by patent no. 3,930,306
1N5059GP thru 1n5062gp vishay semiconductors formerly general semiconductor www.vishay.com document number 88513 2 08-jul-02 ratings and characteristic curves (t a = 25 c unless otherwise noted) 0 fig. 1 ?forward current derating curve average forward rectified current (a) ambient temperature ( c) 25 50 75 100 125 150 175 200 0.2 0.4 0.6 0.8 1.0 60h z resistive or inductive load 0.375" (9.5mm) lead length 0 fig. 2 ?maximum non-repetitive peak forward surge current 1 10 100 number of cycles at 60h z 10 20 30 40 50 peak forward surge current (a) t a = 100 c 8.3ms single half sine-wave (jedec method) fig. 3 ?typical instantaneous forward characteristics 0.4 0.6 0.8 1.0 1.2 1.4 1.6 instantaneous forward voltage (v) 0.01 0.1 1 10 20 instantaneous forward current (a) pulse width = 300 s 1% duty cycle t j = 25 c 0 fig. 4 ?typical reverse characteristics 0.01 0.1 1 10 instantaneous reverse leakage current ( a) 60 80 100 20 40 percent of rated peak reverse voltage (%) t j = 25 c t j = 75 c t j = 125 c fig. 5 ?typical junction capacitance 1 10 100 reverse voltage (v) 1 10 100 junction capacitance (pf) t j = 25 c f = 1.0mh z vsig = 50mvp-p fig. 6 ?typical transient thermal impedance 0.01 0.1 1 10 100 t -- pulse duration (sec) 0.1 10 100 1 transient thermal impedance ( c/w)
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